Tuesday, 20 April 2010

Research Studentship in High Strain Rate Mechanical Engineering

Research Studentship in High Strain Rate Mechanical Engineering

University of Oxford - Department of Engineering Science

We wish to appoint a suitable candidate to the above post which is available for 36 months. The project will investigate the high strain rate properties of PVC.You will have a 1st class, upper second or equivalent degree in engineering, physics, materials science or related discipline with enthusiasm for academic research. The ability to plan and execute a novel research project working independently within a wider research team is essential. Experience in mechanical testing of materials, finite element modelling and high speed photography would be advantageous.

The project will be supervised by Dr CR Siviour, informal queries should be directed to clive.siviour@ eng.ox.ac.uk.

Remuneration will be �14200 pa in 2010/11 (and will increase in subsequent years) and fees will be covered for UK and EU nationals. Additional fees may be payable for overseas nationals.

Candidates are expected to meet the Graduate Admissions criteria available at http://www.eng.ox.ac.uk/postgrad/criteria.pdf and a full graduate application must be made at the same time as applying for this studentship. Further details about making a graduate application are available at http://www.admin.ox.ac.uk/postgraduate/apply

Please send a letter of application for the studentship, which should explain your interest in and relevant experience for the advertised post, together with a detailed CV to: Mr CJ Scotcher, Senior Administrator, Department of Engineering Science, Parks Road, Oxford, OX1 3PJ.

Please quote DF10022 in all correspondence to the Department and in your graduate application.

The closing date for applications is noon 20th April 2010

Committed to equality and valuing diversity.

 

Please give the reference of CareerSetup in your application when applying for this opportunity! 

Subscribe for more updates

Enter your email address:




 
Copyright © 2009 CareerSetup Inc. All rights reserved